Journal of the Japan Society of Polymer Processing
CONTENTS OCTOBER Vol.2 No.5 1990

Special Issue on Electronics & Polymer Materials, Polymer Processing

Technical Note
Polymeric Materials in Electronics and Control of Their Higher Order Structure: Hiroji Ohigashi, 371
Electro-Conductive Plastics and their Polymer Processing: Hidehiro Iwase, 378
Molding Compounds for IC Encapsulation: Osamu Inoue, 385
Plastic Packaging of LSI Devices: Junichi Saeki, 392
Molded Interconnection Devices: Manabu Yamazaki, 398

Technical Reports
An Introduction to Moldflow's Shrinkage and Warpage Analysis Software, MF/WARP: Takakazu Morita, 405

Special Lecture
A Fundamental Theory of Injection CAE Techniques and Its Applications-IV: Yasushi Oyanagi / Sadao Sato / Kazuhisa Kubota, 415

Original Papers
Numerical Simulation of Die Swell of Polymer Melts in Extrusion from Annular Dies: Toshihisa Kajiwara / Tomoyuki Hashimoto / Kazumori Funatsu, 430
A Simple Method to Determine the Viscoelastic Constants of Plastics by Stress Relaxation Measurements:・ Experiment: Tatsuya Ishibashi / Hideki Gawagawa / Takaharu Tezuka / Atsuki Yamaguchi / Yukinari Oguma, 436

Forum
Recycle Polymer Processing: Toshikazu Fujimura, 412

Reports of International Meeting
Report on the IUPAC MACRO 90: Takeshi Kikutani, 411

Instruction for Authors, 454