SMCˆ³k¬Œ`‚É‚¨‚¯‚éd‰»‹““®‰ðÍ
Analysis of Cure Behavior of SMC during Compression Molding
_“c‘׈ÈE“ñ–“Œ\ŒáE“à“¡ ˆê
Hamada, Hiroyuki / Futamata, Keigo / Naito, Hajime
The cure behavior of SMC (Sheet Molding Compound) during compression molding is rather complicated due to heat generation during the cure process and the heterogeneity of the SMC material. The cure behavior is the most important factor for designing SMC products and the mold itself, because cure behavior affects not only the post-deformation state of products after they are removed from the mold but also the flow patterns in the mold. DSC (Differential Scanning Calorimeter) may be an effective and powerful method for studying the cure behavior of various materials but is not as useful for practical products, because the dimensions of DSC specimens are much smaller than that of practical products. Consequently, this means that SMC shows considerable heterogeneous properties for minute specimens. This paper describes a numerical analysis method for studying the cure behavior of SMC. Combining measured temperatures inside the SMC, three-dimensional heat conduction analysis, and considering the heat generation due to chemical diffusion, the heat generation was determined by both data and consequently was defined as a function of temperature inside the SMC. The obtained heat generation function was again used in the heat conduction analysis. Thus, it was possible to obtain a practical temperature-time curve, curing profile and other properties.
Key words: SMC / Compression molding / Cure behavior / Heat generation / Numerical analysis method